Détail de la notice
Titre du Document
High temperature automotive electronics
Auteur(s)
JOHNSON R. Wayne ; EVANS John L. ; JACOBSEN Peter ; ...
Corporation(s) du ou des auteurs
International Society for Optical Engineering Bellingham WA USA (Organisateur de congrès)
Résumé
According to the Freedonia group, OEM demand for automotive electronics is predicted to grow from $20.5B in 1999 to $37B in 2009 corresponding to an increase in electronics per vehicle of $1,208 in 1999 to $1,864 in 2009. New or enhanced automotive systems include intelligent airbags, adaptive cruise control, steer-by-wire, brake-by-wire, electronic stability control, telematics, and passenger entertainment systems. To meet the higher vehicle power requirements for these and other systems the industry is moving to a 42V system. A 42V system will also enable combined starter/alternators and electronic valves. With the switch from hydraulic or mechanical to electronic actuation, distributed control systems with smart actuators are being developed. Placing the electronics at the point of use often exposes the electronics to temperatures well above the conventional 125°C limit. Under-hood temperatures are approaching 140°C, on-engine and in-transmission temperatures are 150-175°C and wheel mounded temperatures are 250°C. This paper will examine the system level motivation for distributed systems and the resulting temperature requirements. The temperature limitations of semiconductor and passive components, and packaging and interconnection technology will then be discussed. An in-transmission control module developed for 150-165°C use will be discussed in detail to identify the unique challenges of high temperature electronics.
Editeur
IMAPS
Type du document
Conférence : ICAPS : international conference on advanced packaging and systems, Reno NV, USA, 2002-03-10
Identifiant
ISSN : ISBN : 0-930815-65-3
Source
SPIE proceedings series A. 2002, vol. 4828, pp. 69-79 [bibl. : 29 ref.]
Langue
Anglais
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